Fron external view of facility 600m
Side view of facility
|High resolution capability||The degree of soldering inspection of 0603Chip / 0.4mm Pitch IC, which is mounted as high density, is more improved by high resolution 10μm Color Line CCD|
|Fixing||Characteristic, High resolution capability : The degree of soldering inspection of 0603Chip / 0.4mm Pitch IC, which is mounted as high density, is more improved by high resolution 10μm Color Line CCD, Fixing : By loading Telemetric Optical Unit(*1) / Digital Shading Function<(*2) upgrading stability of inspection, we solved the refraction and brightness difference of image. More over, by adopting Ball Screw Table Scan(*3) method, we improved stability of repeated degree and compatibilty with other device.
* By using Telemetric, which is developed by own technology, it tis possible to recall accurate image without refraction.
* Brightness difference of image is removed by correcting brghtness per 1 pixel automatically
* Ball Screw is Fixing board on table driven by ball screw scans image.
|Super high speed||We can realize super high processing of the highest-level of industry by using Alternate Color Digital Scanning System(*4), Which is developed by own technology. The width of device is compactly by just 600mm.
M Size Board (250mm X 330mm > About 22 seconds image pickup time)
* Plural image are displayed through 일괄총상 + by line scan method + 1 scan by instantly replace lighting.
|Improvement of inferiority detection||We won't let inferior board flow out by improving the avidity to detect inferiority (swollen chip / lead) in reflow and after process.
* We improved the inspection capacity of riled by adding low lighting to existing 2 kinds of lightings (동출낙사 / side)
|Inspection board measure||50 X 50 ~ 250 X 330mm|
|Thickness||0.3 ~ 2.5mm|
|Allowable wheel scope||+ / -2mm|
|Maximum limit of part height||Upper surface - from board surface 20mm / Lower surface - from board surface 20mm|
|Revolving part inspection||Revolving part inspection by 1 degree unit|
|Inspection item||Existence of part, distortion, standing on side, erection, overturning, polarity, wrong insertion, short, foreign substance, existence of lead, insufficient solder, swollen lead, swollen chip, abnormal fillet, letter recognition, etc|
|Image pickup speed||250 X 330mm : 22 second|
|Inspection time||0.1m second / inspection window|
|Board import and export||10μm|
|Camera||Color digital sensor|
|Transportation height||900+ / -200mm|
|OS||Windows2000 (Japan / English option)|
|Inspection result output||OK / NG signal output, screen display, printing by built-in plotter, printing as receipt form, printing in repair terminal, file output, registration in database*(*mark means option)|
|Power||AC 100, 115, 200, 220, 240 V, 800W, 50/60Hz|
|Air pressure||0.5Mpa, 5L/min|
|Operation temperature / humidity||15 ~ 30℃ /15 ~ 80% (no dew)|
|Outward dimension (W*D*H)||600 * 850 * 1515mm|