





1175mm
50~250mm
630mm
900±20mm
1515mm
850mm

High resolution capability | The degree of soldering inspection of 0603Chip / 0.4mm Pitch IC, which is mounted as high density, is more improved by high resolution 10μm Color Line CCD |
---|---|
Fixing | Characteristic, High resolution capability : The degree of soldering inspection of 0603Chip / 0.4mm Pitch IC, which is mounted as high density, is more improved by high resolution 10μm Color Line CCD, Fixing : By loading Telemetric Optical Unit(*1) / Digital Shading Function<(*2) upgrading stability of inspection, we solved the refraction and brightness difference of image. More over, by adopting Ball Screw Table Scan(*3) method, we improved stability of repeated degree and compatibilty with other device. * By using Telemetric, which is developed by own technology, it tis possible to recall accurate image without refraction. * Brightness difference of image is removed by correcting brghtness per 1 pixel automatically * Ball Screw is Fixing board on table driven by ball screw scans image. |
Super high speed | We can realize super high processing of the highest-level of industry by using Alternate Color Digital Scanning System(*4), Which is developed by own technology. The width of device is compactly by just 600mm. M Size Board (250mm X 330mm > About 22 seconds image pickup time) * Plural image are displayed through 일괄총상 + by line scan method + 1 scan by instantly replace lighting. |
Improvement of inferiority detection | We won't let inferior board flow out by improving the avidity to detect inferiority (swollen chip / lead) in reflow and after process. * We improved the inspection capacity of riled by adding low lighting to existing 2 kinds of lightings (동출낙사 / side) |

BF Plant-X

Inspection board measure | 50 X 50 ~ 250 X 330mm |
---|---|
Thickness | 0.3 ~ 2.5mm |
Allowable wheel scope | + / -2mm |
Maximum limit of part height | Upper surface - from board surface 20mm / Lower surface - from board surface 20mm |
Revolving part inspection | Revolving part inspection by 1 degree unit |
Inspection item | Existence of part, distortion, standing on side, erection, overturning, polarity, wrong insertion, short, foreign substance, existence of lead, insufficient solder, swollen lead, swollen chip, abnormal fillet, letter recognition, etc |
Image pickup speed | 250 X 330mm : 22 second |
Inspection time | 0.1m second / inspection window |
Board import and export | 10μm |
해상도 | 10μm |
Camera | Color digital sensor |
Lighting | White LED |
Transportation decvice | manual |
Transportation height | 900+ / -200mm |
OS | Windows2000 (Japan / English option) |
Inspection result output | OK / NG signal output, screen display, printing by built-in plotter, printing as receipt form, printing in repair terminal, file output, registration in database*(*mark means option) |

Power | AC 100, 115, 200, 220, 240 V, 800W, 50/60Hz |
---|---|
Air pressure | 0.5Mpa, 5L/min |
Operation temperature / humidity | 15 ~ 30℃ /15 ~ 80% (no dew) |
Outward dimension (W*D*H) | 600 * 850 * 1515mm |
weight | 200kg |














